After formally releasing the thinnest collapsible phone in Malaysia, Honor is set to make the next advancement with the international statement of the Honor Magic 6 series at Mobile World Congress 2024, which is set to take place on 25 February 2024, 9PM Malaysia time.
The Honor Magic 6 series is the business’s response to Samsung’s Galaxy S24 series, consisting of the Magic 6 and Magic 6 Pro, these phones have actually currently released back in China and boasts a premium style and updated cams from their particular predecessors.
Powered by the Snapdragon 8 Gen 3 chipset, the Honor Magic 6 series is anticipated to handle the competitors when it concerns photography, especially the Honor Magic 6 Pro, which includes a primary 50MP electronic camera with a variable aperture variety of f/1.4-f/2.0, and an optically supported 180MP telephoto cam that does up to 2.5 x optical zoom.
The Magic 6 Pro likewise includes a big 5600mAh battery that supports 80W quick wired charging and 66W quickly cordless charging, while the routine Magic 6 functions a 5450mAh battery that supports 66W quickly wired charging and 60W quick cordless charging.
These are fantastic enhancements over the Magic 5 series and understanding Honor, we might likewise see it priced more competitively when it releases the phones in Malaysia, so certainly remain tuned for more statements showing up.
Warren
The geeky totalitarian of KLGG.