Foxconn invests $37.2 million to form chip packaging joint venture in India

Foxconn invests $37.2 million to form chip packaging joint venture in India

Foxconn broadens its server assembly service in Mexico with $10 million financial investment. Credit: Foxconn

Foxconn just recently revealed that it is teaming up with the Indian tech huge HCL (Hindustan Computers Limited) to develop a brand-new joint endeavor for chip product packaging and screening operations in India. The collaboration with HCL represents Foxconn’s tactical shift towards the Indian market. The Taiwanese company will own a 40% stake in the brand-new joint endeavor with a $37.2 million financial investment. Foxconn’s Indian subsidiary, Mega Development, prepares to develop an Outsourced Semiconductor Assembly and Testing (OSAT) center in India, while Foxconn is anticipated to invest another $1 billion to develop a brand-new plant in India committed to producing Apple items. Understood for its engineering style and production competence, HCL has actually been actively included in conversations with the federal government of Karnataka, India, around the facility of the brand-new OSAT.[[IThome, in Chinese]


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